Empowering High-Speed AI Data Communications! DoGian Rolls Out Mass Production of CWDM4 100mW High-Power CW DFB Chips and COC Devices

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Driven by the continuous advancement of AI large models and supercomputing center computing power, data center networks are undergoing comprehensive upgrades toward ultra-high speeds of 400G/800G/1.6T alongside low power consumption. High-end silicon photonic transceivers impose stricter requirements on core light sources in terms of power stability, photoelectric conversion efficiency, coupling precision and wide-temperature adaptability. To address pressing industry pain points, DoGian has officially launched its CWDM4 (1270/1290/1310/1330 nm) 100mW high-power CW DFB chips and COC devices. Leveraging its proprietary IDM platform, innovative design and refined manufacturing processes, the company delivers highly reliable, efficient and cost-effective light source solutions for high-speed optical interconnections in AI data centers, with robust large-scale delivery capacity.

Technological Breakthroughs: Self-Developed Core Architecture Delivers Comprehensive Performance Leaps

The newly unveiled CWDM4 100mW high-power CW DFB chip from DoGian features a self-developed aluminum-free PQ highly reliable buried heterostructure (BH) architecture, which fundamentally resolves prevalent industry drawbacks of conventional devices including severe wavelength drift, unstable optical power and insufficient reliability.

The product maintains steady 100mW high-power output and wavelength locking across the full temperature range of 0°C to 75°C, perfectly suited for uncooled wide-temperature complex operating conditions in data centers with negligible performance degradation under high and low temperatures.

In terms of energy efficiency, the chip achieves a room-temperature electro-optic conversion efficiency of up to 30%, significantly cutting the overall power consumption of high-speed optical modules and aligning with the green and low-carbon development trend of data centers. Furthermore, refined optimization of the proprietary BH structure delivers nearly symmetric narrow far-field divergence angles of 20° horizontally and 24° vertically, delivering exceptional beam quality and excellent consistency between near and far fields.

The symmetric beam characteristic greatly eases the coupling between the chip and downstream optical components such as optical fibers and silicon optical waveguides, curtails coupling loss, relaxes precision requirements for packaging alignment, lowers packaging complexity and mass-production yield thresholds for modules, and underpins large-scale, high-efficiency manufacturing across the industry.

Complete System Matching: High-Reliability COC Devices for Ready-to-Use Mass Production Delivery

To complement the superior chip performance and cater to downstream customers’ mass production demands, DoGian has rolled out matching COC packaged devices. Adopting high-thermal-conductivity customized heat sink materials coupled with advanced eutectic packaging technology, these devices boast outstanding heat dissipation, ensuring long-term operational stability under high-power operating conditions.

Subjected to stringent COC-level performance screening, the devices feature high parameter consistency and robust reliability. No secondary tuning or optimization is required for customers; they support plug-and-play and rapid assembly, and are fully compatible with the full lineup of 400G to 1.6T silicon photonic transceivers.

Core Product Advantages

Stable Optical Power Across Full Temperature Range: Sustained stable 100mW high-power output from 0°C to 75°C, immune to data center temperature fluctuations and ideal for uncooled applications
Industry-Leading Low Power Consumption: Up to 30% room-temperature electro-optic conversion efficiency, reducing overall energy use and operating costs for AI data centers
Superior Symmetric Beam Quality: Near-symmetric narrow far-field divergence angles deliver concentrated, consistent beams to guarantee optimal coupling performance fundamentally
Excellent Coupling Compatibility: Perfectly matched with mainstream optical components including optical fibers and silicon optical waveguides; reduced coupling loss streamlines packaging processes and boosts mass-production yield
High-Reliability Mass Delivery: Advanced eutectic packaging paired with high-efficiency heat sinks and standardized performance screening ensure outstanding device consistency and stability. The fully self-controlled end-to-end IDM model enables swift bulk product shipment